单组份，导热系数25w/mk，适合3-5w大功率led和模组。自动点胶机适用。 introduction die attach paste ”kemitite ct285” is epoxy resin based and solvent free type paste. the highest thermal conductivity (25w/mk) good reflow performance due lower moisture absorption resin system. ct285 is effectively used for power ic, transistor. features 1） good workability for dispensing due to solvent free and one liquid type paste. 2） highest thermal conductivity(25w/mk) 3） bleed less. general property properties unit typical value test method appearance – silver filled paste visual viscosity at 25c pa·s 100 ehd viscometer 0.5rpm (3°cone) thixotropic index – 6.0 0.5rpm/2.5rpm non voletile wt% 92.0 180c×2hr silver content wt% 87.5 600c×3hr adhesive strength 25c 300c n 30 20 frame: cu/ppf chip size: 2×2mm volume resistivity ohm.cm 8×10-6 cure: 200c×90min measurement: room temp glass transition temperature c 200 tma modulus(25c) 25c gpa 16.5 dma 260c 7.8 cte alpha 1 ppm 75 tma alpha 2 200 ionic impurity na ppm 6 1 atomic absorption ionchromatography ci thermal conductivity w/m k 25 laser flash 4. standard cure condition 175c×60-90min 5. remarks storage condition is _30 to _15c 6 month caution: property values listed are typical values. the data herein is for information only. 粘合材料类型 : 导电银胶 ; 树脂类型 : 单组分 ; 型号 : ct285 ; 品牌 : 日本京瓷 ;